Glass Cleaners
Incoming module glass needs controlled preparation matched to surface condition, washing method and downstream lay-up.
Flux Removers
SOLARPRO FX-520
Cleaning of printed circuit boards (PCBs) - Removal of rosin, no-clean, activated and water-soluble fluxes - Suitable for SMT, DIP and wave soldered assemblies
Operating / process challenges
Preparation and cleaning decisions change across module assembly.
Everklin Living Process Platform
Solar module assembly process
Inspect the connected module route from stringing and glass preparation through lay-up, lamination, framing, sealant work and final inspection.
System overviewIncoming glass surface condition before lay-up
Select any numbered process point to inspect its operating challenge and treatment context.
Process stages
Monitoring referencesNo live plant values are shown.
Surface ConditionResidue TypeMaterial CompatibilityApplication MethodDrying RequirementFinal Inspection
Choose by task + product workspace
Choose the product for the active process.
The category brief and relevant products stay together. Select a product to open its compact summary and technical tabs.
FX-520
Flux Removers
SOLARPRO FX-520
Specially formulated for the removal of all types of flux residues from electronic assemblies PCBs and components. Fast acting, nonCleaning of printed circuit boards (PCBs) - Removal of rosin, no-clean, activated and water-soluble fluxes - Suitable for SMT, DIP and wave soldered assemblies
Used forStringing and tabbing stations
- Primary application
- Stringing and tabbing stations
- Process / cleaning stage
- Flux Removers
- Target soil / requirement
- Flux and solder-process residue on compatible electrical assembly surfaces
- Application method
- Precision wipe, spray or approved equipment cleaning
- Product role
- Specially formulated for the removal of all types of flux residues from electronic assemblies PCBs and components. Fast acting, non
- Commercial pack
- 25 L
Selected product
Product Overview
Technical Information
At a glance
SOLARPRO FX-520 is Everklin's specially formulated for the removal of all types of flux residues from electronic assemblies pcbs and components. fast acting, non for controlled cleaning around stringing, tabbing and solder operations.
Selection begins with the real process stage, residue or soil, substrate, application method and downstream requirement. Exact operating values and product release information must be confirmed against the current Everklin TDS, SDS and approved site procedure.
Specially formulated for the removal of all types of flux residues from electronic assemblies PCBs and components. Fast acting, non
Flux Removers
Stringing and tabbing stations
Precision wipe, spray or approved equipment cleaning
Flux and solder-process residue on compatible electrical assembly surfaces
Stringing and tabbing stations
Approved interconnect, tooling and equipment materials
25 L
- Product
- FX-520
- Chemistry / format
- Flux residue cleaner
- Application
- Precision wipe, spray or approved equipment cleaning
- Technical values
- Refer to the current approved TDS
Benefits & applications
Supports the selected flux removers when used under the current approved procedure.
Supports the selected flux removers when used under the current approved procedure.
Supports the selected flux removers when used under the current approved procedure.
Supports the selected flux removers when used under the current approved procedure.
Supports the selected flux removers when used under the current approved procedure.
Applications
- Stringing and tabbing stations
- Bussing and solder tooling
- Pre-lamination electrical assembly
How the result should be verified
Inspect and verify the result using the approved process procedure.
How to use
Final values remain subject to the current Everklin TDS and site validation.
Dilution / dosage / concentration
Request the current approved TDS for product-specific dilution or dosage.
| Condition | Use level | Temperature | Time | Method | Rinse / finish |
|---|---|---|---|---|---|
| Flux Removers | Confirm with current Everklin TDS | Process and substrate dependent | Validate against soil release and the current procedure | Precision wipe, spray or approved equipment cleaning | Rinse / finish as specified in the current TDS |
- 01
Use as supplied.
- 02
Apply by wiping, brushing or immersion.
- 03
Allow to dwell for 30 seconds - 1 minute.
- 04
Wipe or rinse with clean water or IPA if required.
- 05
Allow to dry completely before testing or use. MAKE IN INDIA LEAVES NO RESIDUE COMPATIBLE WITH SENSITIVE ELECTRONICS 25 L NET QUANTITY
Technical properties
- Product type
- Specially formulated for the removal of all types of flux residues from electronic assemblies PCBs and components. Fast acting, non
- Chemistry / format
- Flux residue cleaner
- Application method
- Precision wipe, spray or approved equipment cleaning
- Exact measured properties
- Request current approved TDS / COA
Compatibility & safety
Compatible systems / materials
- Approved interconnect, tooling and equipment materials
Restrictions / where not to use
- Confirm electrical, polymer and coating compatibility
- Ensure complete drying and inspection before the next stage
Safety snapshot
- Read the current SDS before handling, storage or use.
- Use the PPE and engineering controls required by the SDS and site risk assessment.
- Keep incompatible chemicals segregated and never mix products without written approval.
- Use trained personnel and the approved dosing / application equipment.
- Follow the site spill, first-aid, disposal and emergency procedure.
Packaging & documents
25 L
Store in a cool dry & well ventilated area. Keep container tightly closed when not in use. Protect from direct sunlight ad heat. IS O 9001:2015 CERTETIED
Product questions
Where does SOLARPRO FX-520 fit in the process?
It is positioned at the flux removers stage shown in the flagship process map.
How should the operating level be selected?
Use the current Everklin TDS and validate the starting condition against soil, substrate, equipment and the approved site procedure.
What compatibility checks are required?
Confirm every product-contact surface, seal, coating, tool and downstream process before wider use. A controlled trial may be required.
What finish or rinse is required?
Follow the product-specific TDS and the process release procedure. Do not infer a no-rinse claim where one is not documented.
Which documents should be reviewed before use?
Review the current Product Information Sheet, Technical Data Sheet and Safety Data Sheet, then record the approved site method.
Selection questions, answered clearly.
How should the right Everklin product be selected?
Start with the active process category, operating objective, soil or residue, materials and application method, then confirm the choice against current product documents.
Where are current dosage and technical values available?
Product-specific values are supplied through the current approved TDS and Everklin technical review.
Which documents should be reviewed before use?
Review the current PIS, TDS and SDS together with the approved site or manufacturing procedure.
Glass Cleaners
Cleaning programmes for module front glass before assembly and lamination.
- Process role
- Connects glass preparation to the material condition and the next bonding or lay-up stage.
- Where it fits
- Glass receiving, washing and pre-lamination preparation.
- Operating objective
- Support a controlled glass-cleaning route appropriate to the installed line.
- Typical zone
- Glass preparation line
Selection considerations
- Glass surface and incoming condition
- Installed washing or wipe process
- Downstream lay-up and lamination context
EVA Adhesive Cleaners
Cleaning programmes for EVA and adhesive residue associated with module assembly.
- Process role
- Treats encapsulant and adhesive residue as a distinct tooling and equipment-cleaning task.
- Where it fits
- Lay-up, lamination tooling and relevant post-lamination cleaning points.
- Operating objective
- Review product fit against the residue condition, cure state and equipment surface.
- Typical zone
- EVA lay-up and lamination equipment
Selection considerations
- Residue and cure-state information
- Tooling and substrate compatibility
- Cleaning method and current product guidance
Frame Degreasers
Degreasing programmes for aluminium frame preparation before assembly.
- Process role
- Keeps machining oil and handling soil review connected to the actual frame surface.
- Where it fits
- Frame preparation before framing and sealant application.
- Operating objective
- Support a controlled preparation route for the frame and downstream assembly step.
- Typical zone
- Frame preparation station
Selection considerations
- Frame finish and incoming soil
- Application and wipe method
- Downstream sealant or assembly context
Silicone Cleaners
Cleaning programmes for silicone and sealant residue in module assembly.
- Process role
- Separates sealant clean-up from general solvent and frame-cleaning decisions.
- Where it fits
- Framing, sealant application, junction-box assembly and relevant tooling.
- Operating objective
- Match the cleaning route to the residue condition and compatible substrate.
- Typical zone
- Sealant and junction-box assembly
Selection considerations
- Silicone or sealant condition
- Surface and equipment compatibility
- Approved clean-up procedure
Flux Removers
Cleaning programmes for flux residue associated with stringing, tabbing and solder operations.
- Process role
- Keeps solder-process residue connected to the interconnect and pre-lamination stage.
- Where it fits
- Cell string preparation, bussing and selected solder-cleaning points.
- Operating objective
- Support controlled residue removal before downstream module assembly.
- Typical zone
- Stringing, tabbing and bussing area
Selection considerations
- Flux and solder-process context
- Cell and interconnect compatibility
- Cleaning method and current product documents
IPA & Specialty Solvents
IPA and specialty solvent options for validated module manufacturing cleaning tasks.
- Process role
- Provides a process-specific solvent family rather than a universal cleaning substitute.
- Where it fits
- Selected tooling, surface-preparation and final clean-down points.
- Operating objective
- Match solvent selection to the actual residue, substrate and process step.
- Typical zone
- Application-specific module assembly zones
Selection considerations
- Residue and surface information
- Required application and drying context
- Site procedure and current product documentation
Process context
Keep assembly surfaces and residues connected.
Assembly surfaces
Map preparation to glass, frame, interconnect and sealant-related assembly stages.
Residue / preparation control
Review each residue against its actual material and process location.
Final production cleaning
Keep final clean-down tied to the completed module and inspection route.
Technical documentation
View Document Library Technical Documentation
Select an Everklin product to request its current technical documentation.
Technical review
Request Technical Review Request Solar Module Manufacturing Review
Share the assembly stage, residue and current manufacturing context with Everklin.